Tokuro Matsuo
Graduate School of Science & Engineering
Yamagata University, Japan
matsuo@tokuro.net

Lynn Andrea Stein
Dept. of Electrical Eng. & Computer Science
Olin College of Engineering , U.S.A.
Needham, MA 02139
las@olin.edu

Roger Y. Lee
Director of Software Engineering and Information Technology Institute
Central Michigan University , U.S.A.
lee1ry@cmich.edu

Chia-Chu Chiang, University of Arkansas, USA, cxchiang@ualr.edu

Yucong Duan, University of Bourgogne, France, duanyucong@hotmail.com

Joachim Hammer , Univ. of Florida , USA, jhammer@cise.ufl.edu

Gongzhu Hu , Central Michigan University , USA, hu@cps.cmich.edu

Naohiro Ishii , Aichi Institute of Technology, Japan, ishii@ics.nitech.ac.jp

Dale Karolak, Intier Automotive Closures, USA, karolad@fhsmtp.fh.trw.com

Haeng-Kon Kim, Catholic University of Daegu, Korea, hangkon@cuth.cataegu.ac.kr

William Leigh , Univ. of Central Florida , USA, William.leigh@bus.ucf.edu

Chao Lu , Towson University, USA, clu@towson.edu

Jixin Ma , University of Greenwich, UK, J.Ma@gre.ac.uk

Brian Malloy , Clemson University, USA, malloy@cs.clemson.edu

John McGregor, Clemson Univ. USA, johnmc@cs.clemson.edu

Huaikon Miao , Shanghai University, China, hkmiao@shu.edu.cn

Pascale Minet, Rocquencourt, France, mailto:pascale.minet@inria.fr

Ana Moreno , Universidad Politecnica de Madrid, Spain, amoreno@asterix.fi.upm.es

Christophe Nicolle , Université de Bourgogne, France, christophe.cruz@u-bourgogne.fr

Allen Parish , Univ. of Alabama -Tuscaloosa , USA , parrish@cs.ua.edu

Susanna Pelagatti , University of Pisa, Italy, susanna@di.unipi.it

David Primeaux , Virginia Commonwealth, USA, dprimeau@mail1.vcu.edu

Minglong Shao , NetApp, Inc, Sunnyvale, CA, USA, shaoml@gmail.com

Jiro Tanaka , University of Tsukuba, Japan, jiro@cs.tsukuba.ac.jp

Chisu Wu, Seoul National University, Korea, wuchisu@selab.snu.ac.kr

Shaochun Xu, Algoma University, Canada, Simon.xu@algoma.ca